Fangjuan Qi,: search on Z-Library

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1

[IEEE 2005 6th International Conference on Electronics Packaging Technology - Shenzhen, China (30 Aug.-2 Sept. 2005)] 2005 6th International Conference on Electronic Packaging Technology - Reliability of Ball Grid Array (BGA) Assembly with Reworkable Capillary Underfill Material

Fangjuan Qi,, Yaping Ding,, Zhanlai Ding,, Hua Fu,

Year:

2005

Language:

english

File:

PDF, 1.00 MB

english, 2005

2

[IEEE ICEPT 2003. Fifth International Conference on Electronic Packaging Technology. Proceedings - Shanghai, China (2003.10.28-2003.10.30)] Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. - Research on failure modes of BGA assemblies with lead-free solder on different PCB materials

Fangjuan Qi,, Jim Liu,

Year:

2003

Language:

english

File:

PDF, 417 KB

english, 2003

3

Mechanical bend fatigue reliability of lead-free and halogen-free PBGA assemblies

Jonnalagadda, K., Fangjuan Qi,, Liu, J.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2005

Language:

english

File:

PDF, 830 KB

english, 2005

4

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - The effects of Ni nanoparticles addition on shear behavior and microstructure of Sn-Ag Lead-free solder

Fangjuan Qi,, Li Sun,, Zhezhe Hou,, Jianqiang Wang,, Cha Qin,

Year:

2008

Language:

english

File:

PDF, 1.10 MB

english, 2008

5

Analysis on brazed joints of diamond with modified Cu-based filler alloy

Lu, Jinbin, Qi, Wenchun, Li, Yang, Qi, Fangjuan, Qian, Mi, Qiu, Xinkai

Journal:

International Journal of Refractory Metals and Hard Materials

Year:

2016

Language:

english

File:

PDF, 967 KB

english, 2016

6

[IEEE 2006 7th International Conference on Electronic Packaging Technology - Shanghai, China (2006.08.26-2006.08.29)] 2006 7th International Conference on Electronic Packaging Technology - The Effect of Reflow Time on Intermetallic Compound in Lead-Free Micro-Joining Joint

Ding, Yaping, Qi, Fangjuan, Xu, Changling, Dong, Hulin

Year:

2006

Language:

english

File:

PDF, 3.94 MB

english, 2006

7

Effects of antimony addition on the microstructures of ZA84 magnesium alloy

Jianqiang Wang, Zhanlai Ding, Fangjuan Qi, Hao Zhu, Yunchang Fan

Journal:

Journal of Alloys and Compounds

Year:

2010

Language:

english

File:

PDF, 442 KB

english, 2010

8

[IEEE 2007 8th International Conference on Electronic Packaging Technology - Shanghai, China (2007.08.14-2007.08.17)] 2007 8th International Conference on Electronic Packaging Technology - The Effect of Aging on Microstructures Evolution and Shear Behaviors in Lead-free Solder Joint

Yang, Minghui, Qi, Fangjuan, Ding, Yaping, Ren, Deliang, Xu, Changling

Year:

2007

Language:

english

File:

PDF, 1.31 MB

english, 2007

9

Evolution of interface carbide diamond brazed with filler alloy containing Cr

Lu, Jinbin, Cao, Ziyang, Qi, Fangjuan, Qian, Mi, Zhang, Wangxi

Journal:

Diamond and Related Materials

Year:

2018

Language:

english

File:

PDF, 6.95 MB

english, 2018

10

Mechanical properties and fracture behaviors on 6061 aluminum alloy under shear stress state

Hao Zhu, Fangjuan Qi

Journal:

Year:

2011

Language:

english

File:

PDF, 543 KB

english, 2011

11

[IEEE 2007 8th International Conference on Electronic Packaging Technology - Shanghai, China (2007.08.14-2007.08.17)] 2007 8th International Conference on Electronic Packaging Technology - The Prediction of Sn-Ag Solder Properties Based on BP Algorithm of Artificial Neutral Network

Li Sun,, Qi, Fangjuan, Hou, Zhezhe, Xiao, Yuehua

Year:

2007

Language:

english

File:

PDF, 924 KB

english, 2007

12

[IEEE The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems - Las Vegas, NV, USA (1-4 June 2004)] The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543) - Mechanical fatigue reliability of PBGA assemblies with lead-free solder and halogen-free PCBs

Jonnalagadda, K., Fangjuan Qi,, Jim Liu,

Year:

2004

Language:

english

File:

PDF, 367 KB

english, 2004

13

Preparation of ITO Nanoparticles by Liquid Phase Coprecipitation Method

Ding, Zhanlai, An, Cunran, Li, Qiang, Hou, Zhezhe, Wang, Jianqiang, Qi, Haibo, Qi, Fangjuan

Journal:

Journal of Nanomaterials

Year:

2010

Language:

english

File:

PDF, 1.51 MB

english, 2010

14

Effect of Local Laser Surfacing on the Fatigue Crack Propagation Rate of Al-alloy 6056 and its Laser Beam Weld

Qi, Fangjuan, Staron, Peter., Ventzke, V.

Journal:

Procedia Materials Science

Year:

2014

Language:

english

File:

PDF, 1.18 MB

english, 2014

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